PRELIMINARY Publication Release Date: June 7, 2005 - 1 - Revision 0.3 ISD1800 SERIES SINGLE-CHIP, SINGLE-MESSAGE VOICE RECORD/PLAYBACK
ISD1800 SERIES - 10 - 7.2. FUNCTIONAL DESCRIPTION EXAMPLE The following example operating sequence demonstrates the functionality of the ISD1800 devi
ISD1800 SERIES Publication Release Date: June 7, 2005 - 11 - Revision 0.3 8. RECLEDoperation The RECLED output pin provides an active-LOW signal
ISD1800 SERIES - 12 - 8. TIMING DIAGRAMS Power-DownDebounce84 msRecord Power-DownOperationPLAYLPLAYERECRECLEDMICMIC REFINPUT MICINPUT MIC REF FIGURE
ISD1800 SERIES Publication Release Date: June 7, 2005 - 13 - Revision 0.3 Power-DownDebounce84 msWink 84 ms Power-DownOperationPLAYLPLAYERECRECL
ISD1800 SERIES - 14 - Power-DownDebounce84 msWink 84 ms Power-DownOperationPLAYLPLAYERECRECLEDMICMIC REFOpenPlaySP +SP -OpenOpenOpen1.2 VOLTS 1.2 VOL
ISD1800 SERIES Publication Release Date: June 7, 2005 - 15 - Revision 0.3 Note: Looping playback operation can be performed by connecting the RE
ISD1800 SERIES - 16 - 9.1 OPERATING CONDITIONS OPERATING CONDITIONS (DIE) CONDITION VALUE Operating temperature range 0°C to +50°C Play voltage (VC
ISD1800 SERIES Publication Release Date: June 7, 2005 - 17 - Revision 0.3 10. ELECTRICAL CHARACTERISTICS 10.1. DC PARAMETERS PARAMETER SYMBOL
ISD1800 SERIES - 18 - 10.2. AC PARAMETERS[1]CHARACTERISTIC SYMBOL MIN[3]TYP[2]MAX[3]UNITS CONDITIONS Sampling Frequency FS 8 KHz [4]ISD1806
ISD1800 SERIES Publication Release Date: June 7, 2005 - 19 - Revision 0.3 11. TYPICAL APPLICATION CIRCUIT ISD1800ROSC VCCDVCCAVSSDVSSASP +SP -MI
ISD1800 SERIES - 2 - 1. GENERAL DESCRIPTION Winbond’s ISD1800 ChipCorder® provides high-quality, single chip, single-message, record/playback solutio
ISD1800 SERIES - 20 - 12. PACKAGE DRAWING AND DIMENSIONS 12.1. 28-LEAD 300MIL SMALL OUTLINE IC (SOIC) PACKAGE 2827262524232221 20 19 18 17161512345 6
ISD1800 SERIES Publication Release Date: June 7, 2005 - 21 - Revision 0.3 12.2. 28-LEAD 600MIL PLASTIC DUAL INLINE PACKAGE (PDIP) – SAMPLES ONLY
ISD1800 SERIES - 22 - 12.3. ISD1800 BONDING PHYSICAL LAYOUT (DIE) ISD1800PLAYL PLAYE REC VSSDVCCDXCLK FTMIC MIC REF AGC SP - VSSASP + VCCAROSCRECLED
ISD1800 SERIES Publication Release Date: June 7, 2005 - 23 - Revision 0.3 ISD1800 PAD (X,Y) COORDINATES (with respect to die center) PAD # P
ISD1800 SERIES - 24 - 13. ORDERING INFORMATION Product Number Descriptor Key ISD18xx Duration: 06 = 6- to 12-second 10 = 8- to 16-second ISD
ISD1800 SERIES Publication Release Date: June 7, 2005 - 25 - Revision 0.3 14. VERSION HISTORY VERSION DATE DESCRIPTION 0.0 May 2003 Preliminary
ISD1800 SERIES - 26 - Winbond products are not designed, intended, authorized or warranted for use as components in systems
ISD1800 SERIES Publication Release Date: June 7, 2005 - 3 - Revision 0.3 3. BLOCK DIAGRAM Internal Clock TimingSampling ClockNonvolatileMultilev
ISD1800 SERIES - 4 - 4. TABLE OF CONTENTS 1. GENERAL DESCRIPTION...
ISD1800 SERIES Publication Release Date: June 7, 2005 - 5 - Revision 0.3 5. PIN CONFIGURATION SOIC/PDIPVSSDRECPLAYEPLAYLNCNCNCNCNCMICNCMIC REFAG
ISD1800 SERIES - 6 - 6. PIN DESCRIPTION PIN NAME PIN NO. I/O FUNCTION VSSD, VSSA1, 16 Ground Supplies: Similar to VCCA and VCCD, the analog and
ISD1800 SERIES Publication Release Date: June 7, 2005 - 7 - Revision 0.3 PIN NAME PIN NO. I/O FUNCTION MIC 10 I Microphone Input: The mic
ISD1800 SERIES - 8 - PIN NAME PIN NO. I/O FUNCTION VCCA, VCCD18, 27 Voltage Supplies: Analog and digital circuits internal to the I1800 devi
ISD1800 SERIES Publication Release Date: June 7, 2005 - 9 - Revision 0.3 7. FUNCTIONAL DESCRIPTION 7.1. DETAILED DESCRIPTION Speech/Sound Quali
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