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MAX44251/MAX44252
20V, Ultra-Precision, Low-Noise Op Amps
Supply Voltage (V
DD
to V
SS
).................................-0.3V to +22V
All Other Pins ..................................(V
SS
- 0.3V) to (V
DD
+ 0.3V)
Short-Circuit Duration to Either Supply Rail ............................ 1s
Continuous Input Current (any pin) ................................. ±20mA
Differential Input Voltage ...................................................... ±6V
Maximum Power Dissipation (T
A
= +70°C)
SOT23 (derate 9.1 mW/°C above +70°C) ................... 727mW
µMAX (derate 4.5 mW/°C above +70°C) ....................362mW
SOIC (derate 8.3 mW/°C above +70°C) ..................666.7mW
Operating Temperature Range ........................ -40°C to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65°C to +150NC
Lead Temperature (soldering, 10s) .............................. +300NC
Soldering Temperature (reflow) .................................... +260NC
SOT23
Junction-to-Ambient Thermal Resistance (Θ
JA
) ....... 196°C/W
Junction-to-Case Thermal Resistance (Θ
JC
) ...............70°C/W
µMAX
Junction-to-Ambient Thermal Resistance (Θ
JA
) ........221°C/W
Junction-to-Case Thermal Resistance (Θ
JC
) ...............42°C/W
SOIC
Junction-to-Ambient Thermal Resistance (Θ
JA
) ........120°C/W
Junction-to-Case Thermal Resistance (Θ
JC
) ...............37°C/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(V
DD
= 10V, V
SS
= 0V, V
IN+
= V
IN-
= V
DD
/2, R
L
= 10kI to V
DD
/2, T
A
= -40°C to +125°C, unless otherwise noted. Typical values are
at +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
POWER SUPPLY
Supply Voltage Range V
DD
Guaranteed by PSRR 2.7 20 V
Power-Supply Rejection Ratio
(Note 3)
PSRR V
DD
= 2.7V to 20V, V
CM
= 0V 140 145 dB
Quiescent Current per Amplifier I
DD
R
L
= J
T
A
= +25NC
1.15 1.55
mA
-40NC < T
A
< +125NC
1.75
Power-Up Time t
ON
25
Fs
DC SPECIFICATIONS
Input Common-Mode Range V
CM
Guaranteed by CMRR test
V
SS
-
0.05
V
DD
-
1.5
V
Common-Mode Rejection Ratio
(Note 3)
CMRR
T
A
= +25NC, V
CM
= -0.05V to (V
DD
-
1.5V)
133 140
dB
-40NC < T
A
< +125NC
130
(8 pages)
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